APAC Wi-Fi Chipset Market revenue to reach $8 Bn by 2026

Published Date: 2021-04-22

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APAC Wi-Fi Chipset Market size is projected to cross USD 8 billion by 2026, according to a latest forecast report by Graphical Research.

The Asia Pacific Wi-Fi chipset industry growth is owing to the increasing penetration of IoT and connected devices in China. According to GSMA Intelligence Mobile Economy 2020 report, the total IoT connections in China were USD 3.6 billion in 2019, which is projected to surpass the USD 8 billion-mark by 2025. A Wi-Fi chipset provides network agility, reduced latency, and high speed, which increases its integration into IoT-connected devices. The proliferation of IoT-connected devices across various industries is expected to amplify the adoption of Wi-Fi chipsets in Asia Pacific.

The tri band segment is predicted to record a CAGR of around 5.5% from 2020 to 2026. The proliferation of Over-the-Top (OTT) media service platforms in countries including India, China, and Japan is projected to increase the adoption of tri-band Wi-Fi chipsets. The tri-band configuration operates over three high-frequency bands, i.e., 2.4GHz, 5 GHz, and 60 GHz, which reduce network distortion and congestions issues in Wi-Fi modems and routers. According to the March 2020 report by Economic Times, the number of online video streaming players in India grew from 24 in 2019 to 35 in 2020. These players offer high-resolution 4K video streaming through their platforms. The rise in video content through online streaming platforms is projected to increase the uptake of tri-band-based Wi-Fi in Asia Pacific.

Browse detailed statistical insights from the report, “Asia Pacific Wi-Fi Chipset Market Size By Band (Single Band, Dual Band, Tri Band), By Standard (IEEE 802.11ay, IEEE 802.11ad, IEEE 802.11ax, IEEE 802.11ac, IEEE 802.11n, IEEE 802.11b/G), By Multiple-input Multiple-output (MIMO) Configuration (Single-user Multiple-input Multiple-output (SU-MIMO), Multi-user Multiple-input Multiple-output (MU-MIMO) [1x1 MU-MIMO, 2x2 MU-MIMO, 3x3 MU-MIMO, 4x4 MU-MIMO, 8x8 MU-MIMO]), By Application (Smartphone, Tablet, Desktop PC, Laptop, Connected Home Devices), Research Report, Country Outlook (China, India, Japan, South Korea, Taiwan), Price Trends, Growth Prospects, Competitive Industry Share & Forecasts, 2020 - 2026” along with the table of contents (ToC) @

https://www.graphicalresearch.com/industry-insights/1752/asia-pacific-wi-fi-chipset-market

South Korea Wi-Fi chipset market accounted for 12% revenue share in 2019 and is estimated to witness over 6% CAGR till 2026. The market growth is attributed to favorable government initiatives, supporting smart factory adoption in the country. For instance, in November 2019, the Finance Ministry, Government of South Korea announced an ambitious plan to build 30,000 smart factories by 2022 to boost the manufacturing capabilities of the country’s Small and Mid-sized Enterprises (SMEs). These smart factories are integrated with IoT gateway devices, automated assembly lines, wireless sensors, and robotic systems, which are connected over secure wireless networks. The integration of these wireless connected devices in smart factories is creating high growth opportunities for the market.

Key companies are continuously focusing on R&D activities to develop technically advanced products compared to their competitors in the market. For instance, in January 2019, MediaTek Inc. launched an intelligent connectivity chipset, which supports Wi-Fi 6 and AP+Bluetooth. The new intelligent chipset has applications in routers, repeaters, gateways, and wireless access points for smart home applications. Some of the major players in the Asia Pacific Wi-Fi chipset market are MediaTek Inc., Cypress Semiconductor Corporation, Intel Corporation, Broadcom, Inc., Qualcomm Technologies, Inc., GCT Semiconductor, Inc., and Microchip Technology Inc., among others.

The Asia Pacific Wi-Fi chipset market research report includes in-depth coverage of the industry with estimates & forecast in terms of revenue in USD million from 2016 to 2026 for the following segments:

Asia Pacific Market, By Standard

  • IEEE 802.11ay
  • IEEE 802.11ad
  • IEEE 802.11ax (Wi-Fi 6 & Wi-Fi 6E)
  • IEEE 802.11ac
  • IEEE 802.11n (SB and DB)
  • IEEE 802.11b/G

Asia Pacific Market, By Band

  • Single
  • Dual
  • Tri

Asia Pacific Market, By MIMO Configuration

  • SU-MIMO
  • MU-MIMO
    • 1x1 MU-MIMO
    • 2x2 MU-MIMO
    • 3x3 MU-MIMO
    • 4x4 MU-MIMO
    • 8x8 MU-MIMO

Asia Pacific Market, By Application

  • Smartphones
  • Tablet
  • Desktop PC
  • Laptop
  • Connected home devices
  • Others

The above information has been provided for the following countries:

  • Asia Pacific
    • China
    • India
    • Japan
    • Taiwan
    • South Korea