Asia Pacific Hermetic Packaging Market size surpassed USD 959.9 million in 2020 and is expected to grow at 9.6% CAGR between 2021 and 2027. The increasing use of electronic items in Asia Pacific will drive the market demand.
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Hermetic packaging is a type of airtight packaging that is mainly utilized to protect product properties from harsh environmental conditions. This packaging is mainly used during transportation and logistics, thereby increasing the acceptability of the product. This packaging has applications in all major industries such as automotive, aerospace, medical, marine, optical, and electronics.
The electronic sector in Asia Pacific is experiencing a drastic growth, further fueling the hermetic packaging industry growth. Moreover, the growth of the electronic industry specifically in India and China will majorly contribute to the increasing demand for such packaging in the region. There is an increase in the use of semi-conductors & diodes in electronic components, resulting in a strong need to protect these sensitive components to increase acceptability of the product.
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The metal-can segment will showcase around 9.4% growth rate during the forecast period, attributed to their high functionality and appealing appearance. The ability of these metal-cans to seal the product with high air resistance coupled with high strength and durability has led to an increase demand.
The transistors segment will hold over 30% revenue share by 2027, as these are one of the main components in electronic devices and must be protected from harsh environments. Currently, they find applications in switches, current & voltage amplifiers, and integrated circuits. This equipment is used in various sectors such as military & defense, aerospace, automobiles, etc., thus creating a demand for transistors and subsequently contributing to the industry growth.
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The glass-metal sealing segment from Asia Pacific hermetic packaging market will cross USD 770 million revenue by 2027, owing to its high insulation properties. This type of packaging can withstand high temperatures and can resist harsh environments, and these properties have made it one of the most sought-after hermetic packaging in Asia Pacific.
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There is an increasing demand for high standard and good quality military equipment from many countries in Asia Pacific. The military & defense segment will generate more than USD 650 million revenue by 2027. The advanced technological adoption in military & defense equipment will make proper packaging and careful handling more important; hence, the use of hermetically packed equipment is expected to increase.
Some of the leading companies involved in the Asia Pacific are SCHOTT AG, AMTEK, Inc., Amkor Technology, Materon Corporation, KYOCERA Corporation, Teledyne Technology, Micross, Winchester Interconnect, Renesas Electronic Corporation, and Heramatic Solution Group.
Companies are focusing on strategic expansion. Many companies are focusing on initiatives such as mergers, acquisitions, and strategic collaborations for expansion. Facility expansion and growth opportunities to enter new markets are major trends among market players.